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Rapid Cure Polyurethane Potting Compound Thermal Conductive For Electronics 6806-6-3R

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Rapid Cure Polyurethane Potting Compound Thermal Conductive For Electronics 6806-6-3R

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Color : Black

Curetime : 4 hours

Mix Ratio : 1:5 (by weight)

Thermal conductivity : 0.4 W/m·K

Waterproof : IP68

Hardness : ShoreA 70

Material Type : Polyurethane

Product Name : Polyurethane Potting Compound For High-Efficiency Power Electronics Production

Application : High-volume power electronics production

Operating Temperaturerange : -40°C to 120°C

Brand Name : BaiZhuang

Model Number : BZ-6806-2

Certification : RoHS,REACH

Place of Origin : China

MOQ : 750KG

Price : Negotiable

Payment Terms : T/T,L/C,D/A,D/P

Supply Ability : 1000 Tons per Month

Delivery Time : 7 working days after payment

Packaging Details : 6806-6-3R A for 5kg/10kg;6806-6-3R B for 25KG/200KG

Viscosity : 1000 mPa·s

Dielectric Strength : 18 to 25 kV/mm

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Fast-Cure Polyurethane Potting Compound for High-Efficiency Power Electronics Production

BZ-6806-6-3R – a two-component polyurethane encapsulant designed for rapid insulation, sealing, and moisture protection in power supplies, industrial controllers, power tool PCBs, and EV converters. With UL94 V-0 rating, fast cure, and improved thermal conductivity, it boosts throughput and meets rigorous safety norms. RoHS-compliant, it performs reliably from -40°C to 120°C, with water absorption ≤0.5% for enduring high-power use.

Key Product Features

  1. UL94 V-0 certified: effectively curbs flame spread in critical assemblies.
  2. Rapid turnaround: cures in 2–6 hrs at 25°C, or ≤20 min at 60°C, suiting mass production.
  3. Simple 1:5 weight ratio: cuts waste, works with automated dispensers.
  4. Thermal conductivity ≥0.50 W/m·k: dissipates heat to enhance component longevity.
  5. High insulation strength: breakdown voltage ≥15 kV/mm, surface resistivity ≥1.0×10¹¹ Ω/sq.
  6. Balanced flexibility: Shore A 73±10, absorbs vibration and thermal stress.
  7. Globally compliant: meets RoHS and UL94 V-0, easing international market entry.

Technical Parameters

Parameters

Hardener

BZ-6806-6-3R A

Resin

BZ-6806-6-3R B

Before curing

Appearance

Brown liquid

Black liquid

Viscosity(mPa·s.25℃)

400±150

12000±5000

Initial mixed viscosity(mPa·s.25℃)

2800±800

Density(g/cm³.25℃)

1.20±0.05

1.65±0.05

Mixing

&

Curing

Mix ratio(by weight)

A:B=1:5

Pot life 130±30g(min.25℃)

10-60

(Adjustable for process/temperature )

Curing condition

Room temperature curing

Surface drying time 30g(H.25℃)

0.5-2

(Adjustable for process/temperature )

Curing time 30g(H.25℃)

2-6

(Adjustable for process/temperature )

Curing time(Heated)

60℃ heated 20 min

After curing

Color

Black

Hardness (Shore A)

73±10

Temperature resistance(℃)

-40~120

Flame retardancy UL94

V0

Thermal conductivity(W/m.k)

≥0.50

Water absorption(24H)

0.5%

Surface resistivity(Ω/sq)

≥1.0×1011

Volume resistivity(Ω.cm)

≥1.0×1010

Tensile strength(MPa)

≥2

Dielectric constant(at 50Hz)

4

Breakdown voltage(kV/mm)

≥15


Rapid Cure Polyurethane Potting Compound Thermal Conductive For Electronics 6806-6-3R

Product Applications

  1. High-Volume Power Supplies: Encapsulates consumer electronics chargers, industrial power inverters, and server power units, supporting rapid production lines.
  2. New Energy Vehicle Components: Insulates battery management systems (BMS), on-board chargers, and DC-DC converters, withstanding extreme temperature fluctuations and mechanical vibration.
  3. Industrial Controllers: Seals PLCs, motor drives, and power tool control boards, protecting against dust, moisture, and harsh manufacturing environments.
  4. Renewable Energy Systems: Protects solar inverters and wind turbine controllers, ensuring long-term reliability in outdoor installations with fire safety requirements.
  5. Telecommunications Infrastructure: Encapsulates base station power modules and signal processing units, enhancing durability in enclosed telecom cabinets.


Directions for Use

  1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc.
  2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
  3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
  4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
  5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
  6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
  7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
  8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.


Packing & Shipping & Storage

  1. Hardener: Typically 5KG/10KG/25KG/200KG metal or plastic drums.
  2. Resin: Typically 25KG/200KG metal or plastic drums.
  3. Store and transport as a general chemical product.
  4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
  5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

    Rapid Cure Polyurethane Potting Compound Thermal Conductive For Electronics 6806-6-3R

Product Tags:

Rapid Cure Polyurethane Potting Compounds

      

Electronics Polyurethane Potting Compounds

      

Polyurethane thermal conductive potting

      
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